Hollow glass microspheres materials are widely used in electronic sealants, electronic substrates and heat sinks. Such as copper clad laminates are indispensable materials for the electronics industry. In addition to meeting basic performance requirements, they are constantly developing towards thin, light, and low dielectric. Hollow glass beads have ultra-low dielectric constant, light weight, thermal insulation, and insulation Features such as are widely used in materials such as electronic sealants and electronic substrates. With the development of the electronics industry and the increasing performance requirements for materials, the amount of hollow glass microspheres will continue to increase.
The related products: electronic sealants, heat sinks, electronic substrates, 5G
The recommended models: 25P1500, 32P3500, 38P5500, 46P8000